精密 PCB 制造PRECISION PCB MANUFACTURING
从工程数据到量产现实。From engineering data to production reality.
以上数字描述本站在设计上所依据的模拟配置，并非实测产能。These figures describe the simulated configuration this site is designed around. They are not measured production capability.
改变配置，看板子怎么变。Change the configuration. Watch the board.
五个选项各自改变板子的结构。这是配置预览，不是可制造性判定。Each option changes the board's structure. This is a configuration preview, not a DFM verdict.
剖开看这块板。A section through the board.
四层板，总厚 1.60 mm。每一层都列出厚度、材料与用途。Four layers, 1.60 mm overall. Each layer is listed with its thickness, material and what it is for.
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- 铜厚Copper thickness
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- 材料Material
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- 典型用途Typical application
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从数据到电路板。From data to board.
往下滚动，右侧的板子会跟着工序变化：先是资料，接着内层、压合、钻孔、镀铜、外层线路、防焊、丝印，最后是成品。Scroll, and the board beside the list changes with the process: data first, then inner layers, lamination, drilling, plating, outer copper, solder mask, silkscreen, finished board.
工程ENGINEERING
Gerber · DFM · CAM
工程资料进来，先被读成一组可以制造的指令。层数、线宽、间距、钻孔与阻抗在这里被确认。Engineering data arrives and is read as a set of manufacturable instructions. Layer count, trace width, spacing, drill and impedance are confirmed here.
物料MATERIAL
基材选择Material selection
按电气、热与成本选定基材与叠构，并确认压合后的介质厚度。Base material and stack-up are chosen against electrical, thermal and cost requirements, then dielectric thickness after lamination is confirmed.
内层INNER LAYER
成像 · 蚀刻Imaging · Etching
内层涂布、曝光、显影与蚀刻，形成内层线路。Inner layers are coated, exposed, developed and etched to form the inner copper.
压合LAMINATION
高温 · 高压High pressure · High temperature
叠合后在高温高压下压合成一整块板。介质厚度在这一步定型，之后不再改变。The stack is bonded under high pressure and temperature. Dielectric thickness is set at this step and does not change afterwards.
钻孔DRILLING
机械 · 激光Mechanical · Laser
机械钻通孔，激光钻微盲孔。孔位精度决定后续所有对位工序的上限。Mechanical drilling for through holes, laser for microvias. Hole position accuracy sets the ceiling for every alignment step that follows.
电镀PLATING
沉铜 · 表面处理Copper · Surface treatment
孔壁镀铜导通各层，再按图纸要求做表面处理。Barrel plating connects the layers; surface treatment follows according to the finish specified on the drawing.
AOI
自动光学检测Automated optical inspection
每一面板以光学方式与 CAM 数据比对，找出开路、短路与外观缺陷。Every panel is compared optically against the CAM data to find opens, shorts and cosmetic defects.
电测E-TEST
100% 电性测试100% electrical testing
以飞针或专用治具对每一片板做电性测试，确认全部网络的连通与绝缘。A flying probe or fixture tests each board electrically, confirming continuity and isolation across every net.
终检FINAL QC
检验 · 包装Inspection · Packaging
外观、尺寸与阻抗复检，通过后真空包装并附检测记录。Visual, dimensional and impedance checks; passing boards are vacuum packed with their inspection record.
出货SHIPMENT
可追溯发货Traceable dispatch
批号、物料与检测记录随板出货，可一直回溯到生产参数。Lot, material and inspection records ship with the boards and trace back to the production parameters.
右侧模型是工序的可视化，不是该阶段的真实影像。The model on the right illustrates the stage. It is not a photograph of the real process.
质量是量出来的。Quality is measured.
六项检测各自回答一个问题。没有一项是抽检。Six checks, each answering one question. None of them samples.
自动光学检测Automated Optical Inspection
逐板与 CAM 数据比对，开路、短路与外观缺陷在出厂前被拦下。Every panel is compared against the CAM data; opens, shorts and cosmetic defects are caught before shipment.
全网电性测试100% Electrical Testing
飞针或专用治具对全部网络做导通与绝缘测试，不做抽检。Flying probe or dedicated fixtures test every net for continuity and isolation. No sampling.
内部结构 X 光检测Internal Structure Inspection
多层板压合后以 X 光检视对位与孔铜，看见相机看不到的层。After lamination, X-ray inspection checks registration and barrel copper — the layers a camera cannot see.
受控阻抗量测Controlled Impedance
以时域反射量测阻抗，确认受控阻抗网络落在公差之内。Time-domain reflectometry measures impedance and confirms controlled-impedance nets sit inside tolerance.
切片分析Cross Section Analysis
切片后在显微镜下量孔铜、介质厚度与蚀刻形状。A cross section is measured under a microscope: barrel copper, dielectric thickness and etch profile.
外观与尺寸终检Visual + Dimensional
外观、板边、孔径与板厚做最后确认，并留下随批的检测记录。Final visual, edge, hole and thickness confirmation, and the inspection record that goes with the lot.
车间，作为一个系统。The floor, as a system.
设备状态、工程进度与检测结果在同一条数据线上流动。Equipment state, engineering progress and inspection results move along one data path.
为复杂系统而造。Built for complex systems.
汽车电子AUTOMOTIVE
ADAS · EV · BMSADAS · EV · BMS
工业控制INDUSTRIAL
机器人 · PLC · 自动化Robotics · PLC · Automation
医疗MEDICAL
影像 · 监护 · 诊断Imaging · Monitoring · Diagnostic
航空航天AEROSPACE
航电 · 通信Avionics · Communication
消费电子CONSUMER
IoT · 可穿戴 · 智能设备IoT · Wearables · Smart Devices
为复杂需求而工程化。Engineered for complexity.
以下为示例案例与示例数字，并非真实客户或订单。The cases and figures below are samples, not real customers or orders.
六层高 Tg PCB6-LAYER HIGH-Tg PCB
- 难点Challenge
- 高温环境下的受控阻抗网络，同时要求散热与可靠性。Controlled impedance in a high-temperature environment, with thermal and reliability requirements at the same time.
- 方案Solution
- 高 Tg FR-4，50 Ω 阻抗控制，外层 2 oz 铜。High-Tg FR-4, 50 Ω impedance control, 2 oz outer copper.
- 结果Result
- 12 万120,000 片 / 月PCS / MONTH
示例数字，非真实产能。Sample figure, not a real capacity.
参考资料。Reference material.
PCB 设计指南PCB DESIGN GUIDELINES
线宽、间距、孔径与叠构的设计下限。Design minimums for trace, space, hole and stack-up.
DFM 检查清单DFM CHECKLIST
出图前逐项确认，减少往返改版。Work through before releasing data, to cut revisions.
基材手册MATERIAL GUIDE
Tg、Dk、Df 与各基材的适用场景。Tg, Dk, Df and where each base material belongs.
表面处理手册SURFACE FINISH GUIDE
五种表面处理的厚度、平整度与保存期。Thickness, flatness and shelf life of five finishes.