为复杂系统而造。Built for complex systems.
不同行业对板子的要求并不相同。汽车要热余量与可靠性，工业要长期供应，医疗要洁净与追溯，航空航天要重量与环境耐受，消费电子要密度与成本。Sectors demand different things. Automotive wants thermal margin and reliability, industrial wants long-term supply, medical wants cleanliness and traceability, aerospace wants weight and environmental tolerance, consumer wants density and cost.
为复杂系统而造。Built for complex systems.
汽车电子AUTOMOTIVE
ADAS · EV · BMSADAS · EV · BMS
耐高温、抗振动，受控阻抗与长期可靠性并重。Thermal margin and vibration resistance, with controlled impedance and long-term reliability.
工业控制INDUSTRIAL
机器人 · PLC · 自动化Robotics · PLC · Automation
长期供应与稳定料号，生命周期以十年计。Long-term supply and stable part numbers over a ten-year life cycle.
医疗MEDICAL
影像 · 监护 · 诊断Imaging · Monitoring · Diagnostic
洁净度、可追溯性与低缺陷率优先于成本。Cleanliness, traceability and a low defect rate ahead of cost.
航空航天AEROSPACE
航电 · 通信Avionics · Communication
轻量、耐环境，且每一批都可完整回溯。Low weight and environmental tolerance, with full traceability on every lot.
消费电子CONSUMER
IoT · 可穿戴 · 智能设备IoT · Wearables · Smart Devices
密度与成本主导，换代快，样品到量产要短。Density and cost lead; generations turn over fast and prototype-to-volume has to be short.
为复杂需求而工程化。Engineered for complexity.
以下为示例案例与示例数字，并非真实客户或订单。The cases and figures below are samples, not real customers or orders.
六层高 Tg PCB6-LAYER HIGH-Tg PCB
- 难点Challenge
- 高温环境下的受控阻抗网络，同时要求散热与可靠性。Controlled impedance in a high-temperature environment, with thermal and reliability requirements at the same time.
- 方案Solution
- 高 Tg FR-4，50 Ω 阻抗控制，外层 2 oz 铜。High-Tg FR-4, 50 Ω impedance control, 2 oz outer copper.
- 结果Result
- 12 万120,000 片 / 月PCS / MONTH
示例数字，非真实产能。Sample figure, not a real capacity.
八层 HDI 控制板8-LAYER HDI CONTROL BOARD
- 难点Challenge
- BGA 间距 0.4 mm，需要在有限面积内完成逃逸布线。0.4 mm BGA pitch, with escape routing needed inside a limited area.
- 方案Solution
- 0.15 mm 激光微盲孔，任意层互连，ENIG 表面处理。0.15 mm laser microvias, any-layer interconnect, ENIG finish.
- 结果Result
- 8 层 · 0.4 mm 间距LAYERS · 0.4 MM PITCH
示例案例，非真实客户。Sample case, not a real customer.