CAPABILITIES
产线能做什么。What the line is set up to produce.
下面的数字描述本站在设计上所依据的模拟配置。每一项都可以在右侧配置器中更改，看它对板子结构的影响。The figures below describe the simulated configuration this site is designed around. Each one can be changed in the explorer to see what it does to the board.
32
最大层数MAX LAYERS
2 – 32 层2 – 32 layer capability
3 / 3
线宽 / 间距TRACE / SPACE
mil，HDI 可再细mil, tighter with HDI
600 × 800MM
最大板尺寸MAX BOARD
拼板尺寸上限panel size limit
0.15MM
最小微孔MICRO VIA
激光钻孔laser drilled
±10μm
对位精度REGISTRATION
层间对位控制layer-to-layer control
24 / 7
生产模式PRODUCTION
三班制three shifts
以上数字描述本站在设计上所依据的模拟配置，并非实测产能。These figures describe the simulated configuration this site is designed around. They are not measured production capability.
Capability Explorer
改变配置，看板子怎么变。Change the configuration. Watch the board.
五个选项各自改变板子的结构。这是配置预览，不是可制造性判定。Each option changes the board's structure. This is a configuration preview, not a DFM verdict.
层数Layers4L
基材MaterialFR-4
工艺TechnologySTANDARD
铜厚Copper1 OZ
表面处理Surface FinishENIG
层数配置Layer configurationOK
基材MaterialOK
表面处理Surface finishOK
工程可行性Engineering feasibilityOK
模拟配置Simulated configuration
这里没有真实计算引擎，因此不做真实判定。真实的可制造性评审需要实际 Gerber 数据。There is no calculation engine behind this, so it does not pretend to make a real judgement. A real manufacturability review needs the actual Gerber data.
Surface Finish
五种表面处理，五种取舍。Five finishes, five trade-offs.
| 代号Code | 工艺Process | 厚度Thickness | 特点Property | 典型用途Typical use |
|---|---|---|---|---|
| HASL | 热风整平Hot Air Solder Levelling | ±25 μm | 最便宜，平整度差Cheapest, least flat | 通孔板、低密度Through-hole, low density |
| ENIG | 化学镍金Electroless Nickel Immersion Gold | 3–6 μm Ni / 0.05–0.1 μm Au | 平整，保存期长Flat, long shelf life | 细间距、BGA、压接Fine pitch, BGA, press-fit |
| OSP | 有机保焊膜Organic Solderability Preservative | 0.2–0.5 μm | 平整，保存期短Flat, short shelf life | 大批量 SMTHigh volume SMT |
| Immersion Silver | 沉银Immersion Silver | 0.1–0.3 μm | 平整，适合高频Flat, good for high frequency | 射频、高速RF, high speed |
| Immersion Tin | 沉锡Immersion Tin | 0.8–1.0 μm | 平整，无铅Flat, lead-free | 压接Press-fit, press-in |
Base Material
板子是由什么做的。What the board is made of.
| 代号Code | 材料Material | 关键参数Key figure | 适用场景Where it belongs |
|---|---|---|---|
| FR-4 | 常规 FR-4Standard FR-4 | Tg 130–140 °C | 通用板General purpose |
| High Tg | 高 Tg FR-4High-Tg FR-4 | Tg ≥ 170 °C | 无铅组装、多层板Lead-free assembly, multilayer |
| Rogers | 罗杰斯 4000 系列Rogers 4000 series | Dk 3.0–3.8 | 高频、阻抗敏感High frequency, impedance critical |
| PI | 聚酰亚胺Polyimide | Tg 260 °C+ | 柔性板与软硬结合板Flexible and rigid-flex |
| PTFE | 聚四氟乙烯PTFE | Dk 2.1–2.3 | 毫米波、低损耗Millimetre wave, low loss |
| Metal Core | 金属基（铝 / 铜）Aluminium / copper core | 导热通路Thermal path | LED、电源转换LED, power conversion |
PCB Anatomy
剖开看这块板。A section through the board.
四层板，总厚 1.60 mm。每一层都列出厚度、材料与用途。Four layers, 1.60 mm overall. Each layer is listed with its thickness, material and what it is for.
叠层Layer
—
- 铜厚Copper thickness
- —
- 材料Material
- —
- 典型用途Typical application
- —