TECHNOLOGY
板子是怎么叠出来的。How the board is put together.
叠构决定阻抗，阻抗决定信号。这一页把四个互相牵动的选择放在一起：层数与介质厚度、基材、微盲孔、阻抗控制。Stack-up sets impedance, and impedance sets signal behaviour. This page puts the four coupled decisions together: layer count and dielectric thickness, base material, microvias, and impedance control.
PCB Anatomy
剖开看这块板。A section through the board.
四层板，总厚 1.60 mm。每一层都列出厚度、材料与用途。Four layers, 1.60 mm overall. Each layer is listed with its thickness, material and what it is for.
叠层Layer
—
- 铜厚Copper thickness
- —
- 材料Material
- —
- 典型用途Typical application
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Process Window
叠构背后的数字。The numbers behind the stack.
层数Layer count2 – 32
最大板尺寸Max board size600 × 800 mm
最小线宽 / 线距Min trace / space3 / 3 mil（0.075 mm）3 / 3 mil (0.075 mm)
最小机械钻孔Min mechanical drill0.20 mm
最小激光孔Min laser via0.10 mm
纵横比Aspect ratio10 : 1
板厚Board thickness0.4 – 3.2 mm
铜厚Copper weight1 – 6 oz
阻抗公差Impedance tolerance±10 %
阻焊Solder maskLPI，哑光绿 / 黑LPI, matte green / black
表面处理Surface finishHASL · ENIG · OSP · ImAg · ImSn
基材DielectricFR-4 · High-Tg · Rogers · PI · PTFE
模拟配置Simulated configuration
这里没有真实计算引擎，因此不做真实判定。真实的可制造性评审需要实际 Gerber 数据。There is no calculation engine behind this, so it does not pretend to make a real judgement. A real manufacturability review needs the actual Gerber data.