从数据到电路板。From data to board.
往下滚动，右侧的板子会跟着工序变化：先是资料，接着内层、压合、钻孔、镀铜、外层线路、防焊、丝印，最后是成品。Scroll, and the board beside the list changes with the process: data first, then inner layers, lamination, drilling, plating, outer copper, solder mask, silkscreen, finished board.
从数据到电路板。From data to board.
往下滚动，右侧的板子会跟着工序变化：先是资料，接着内层、压合、钻孔、镀铜、外层线路、防焊、丝印，最后是成品。Scroll, and the board beside the list changes with the process: data first, then inner layers, lamination, drilling, plating, outer copper, solder mask, silkscreen, finished board.
工程ENGINEERING
Gerber · DFM · CAM
工程资料进来，先被读成一组可以制造的指令。层数、线宽、间距、钻孔与阻抗在这里被确认。Engineering data arrives and is read as a set of manufacturable instructions. Layer count, trace width, spacing, drill and impedance are confirmed here.
物料MATERIAL
基材选择Material selection
按电气、热与成本选定基材与叠构，并确认压合后的介质厚度。Base material and stack-up are chosen against electrical, thermal and cost requirements, then dielectric thickness after lamination is confirmed.
内层INNER LAYER
成像 · 蚀刻Imaging · Etching
内层涂布、曝光、显影与蚀刻，形成内层线路。Inner layers are coated, exposed, developed and etched to form the inner copper.
压合LAMINATION
高温 · 高压High pressure · High temperature
叠合后在高温高压下压合成一整块板。介质厚度在这一步定型，之后不再改变。The stack is bonded under high pressure and temperature. Dielectric thickness is set at this step and does not change afterwards.
钻孔DRILLING
机械 · 激光Mechanical · Laser
机械钻通孔，激光钻微盲孔。孔位精度决定后续所有对位工序的上限。Mechanical drilling for through holes, laser for microvias. Hole position accuracy sets the ceiling for every alignment step that follows.
电镀PLATING
沉铜 · 表面处理Copper · Surface treatment
孔壁镀铜导通各层，再按图纸要求做表面处理。Barrel plating connects the layers; surface treatment follows according to the finish specified on the drawing.
AOI
自动光学检测Automated optical inspection
每一面板以光学方式与 CAM 数据比对，找出开路、短路与外观缺陷。Every panel is compared optically against the CAM data to find opens, shorts and cosmetic defects.
电测E-TEST
100% 电性测试100% electrical testing
以飞针或专用治具对每一片板做电性测试，确认全部网络的连通与绝缘。A flying probe or fixture tests each board electrically, confirming continuity and isolation across every net.
终检FINAL QC
检验 · 包装Inspection · Packaging
外观、尺寸与阻抗复检，通过后真空包装并附检测记录。Visual, dimensional and impedance checks; passing boards are vacuum packed with their inspection record.
出货SHIPMENT
可追溯发货Traceable dispatch
批号、物料与检测记录随板出货，可一直回溯到生产参数。Lot, material and inspection records ship with the boards and trace back to the production parameters.
右侧模型是工序的可视化，不是该阶段的真实影像。The model on the right illustrates the stage. It is not a photograph of the real process.